Finnah Engineering u. Packaging GmbH
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Customised electrotechnology

Defined interfaces with the world’s software giants

H+E PACKTEC defines six key automatisation modules within the field of electrotechnology:

  • Control
  • Power-assisted drive technology
  • Visualisation
  • Machine and operational data capture
  • Communication
  • Documentation

The standardised intermodular interfaces enable the application and combination of a variety of manufacturer technologies. H+E PACKTEC is thus able to equip each packaging machine with the soft- and hardware which corresponds to the customer’s specifications. The scope of each module is implemented in consultation with the customer and in accordance with the latter’s requirements.

Sufficient technical reserves are retained for future enhancements.

Compact operating panels, remote diagnosis options and integration into the in-house networks are a given.

 


We are the manufacturers of the world’s first packaging machine with fully power-assisted drive technology. H+E PACKTEC has gained experience with the machines of almost all the reputable manufacturers and has defined standardised interfaces accordingly.

Long term spare parts availability is ensured by the use of catalogue items from internationally established suppliers only, whose training programmes can also be utilised.

H+E PACKTEC enables you to minimise your spare parts stocks because – in consultation with us – you are able to select the electrotechnical machine components according to the machinery available.  

Safety functions such as “Emergency Stop”, as well as improved operational comfort, maintenance and repairs are revised on a regular basis in order to remain one step ahead of the statutory requirements.


 


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